·Process Control Methods for High Yield and Stable Volume Production:
In semiconductor manufacturing, the most dangerous issues are often not obvious out-of-spec events, but invisible and persistent process variations.
Wafer fabrication involves hundreds to thousands of tightly coupled process steps, each operating within extremely narrow process windows. Even a minor parameter shift can be amplified through downstream processes, eventually resulting in:
Yield degradation
Parameter distribution drift
Large-scale scrapping of high-value wafer lots
This reality determines that the semiconductor industry cannot rely on end-of-line inspection to ensure quality. Instead, it must continuously answer two critical questions during production:
Is the process stable?
Is the process still under control?
Statistical Process Control (SPC) exists precisely to address these questions and has become a foundational capability in modern semiconductor manufacturing.